全球无线连接市场

报告亮点

The global market for wireless connectivity technologies is estimated to grow from $65.2 billion in 2021 to $130.6 billion by 2026, at a compound annual growth rate (CAGR) of 14.9% during the forecast period of 2021-2026.

Report Includes

• 41 data tables and 75 additional tables
• 无线连通性和生态系统中无线连通性和相关技术的概述
• 对全球市场趋势的分析，从2020年开始的数据，估计为2021、2022和2024，以及至2026年复合年增长率（CAGR）的预测
• Estimation of market size and market forecast for wireless connectivity technologies, and corresponding market share analysis by technology type, network type, application, and geography
• 新兴技术趋势，市场机会和威慑力量的亮点估计了当前和未来对无线连接的需求，以及对最适合满足这一需求的公司的识别
• Discussion of market dynamics, value chain analysis, industry structure, regulatory scenario, and penetration of technologies within the global market
• Impact of the COVID-19 pandemic on the wireless connectivity industry
• 在市场上审查专利和未决专利申请的无线连接性
• Insight into the growth development strategies of the major players operating within the global market; their key competitive landscape and company share analysis
• Profile descriptions of the leading industry players, including Broadcom Inc., Intel, Qualcomm, MediaTek Inc., NXP Semiconductors and Murata Manufacturing Co., Ltd.

报告范围

该报告概述了全球无线连接性市场，并分析了市场趋势。该报告使用2020年作为基准年，提供了2021年至2026年预测期的估计市场数据。此期间的收入预测是根据技术，网络类型，应用程序和地区进行细分的。

The report also focuses on the major driving trends and challenges that affect the market and the vendor landscape. The report explains the current trends in the wireless connectivity market. The report concludes with detailed profiles of the major players in the global wireless connectivity market.

分析师证书

BCC出版人员组成的专家分析师组成，他们擅长进行主要研究，二级研究和数据分析，并拥有数十年的综合经验，这些经验涵盖了包括医疗保健，高级材料和新兴技术在内的广泛行业。总的来说，该团队代表了一系列多样化的教育成就，在微生物学，电气工程，企业管理和手术等领域完成了个人研究生工作。